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> 3D vertical stacking to achieve sub-micron interconnect > To be used in TY64 SuperNode & HS128 SuperCluster as Zephyr says, hard to believe this loo…
> 3D vertical stacking to achieve sub-micron interconnect> To be used in TY64 SuperNode & HS128 SuperClusteras Zephyr says, hard to believethis looks like a fast-following on Huawei's press releasestphuang: 东方算芯's DF1000 unveiled in Shanghai uses 14nm process but delivers 520 TFLOPS BF16 compute.Uses DRAM-Logic wafer-l